and Guo, Z., Enhanced Conduction and Pool Boiling Heat Transfer on Single-Layer Graphene Coated Substrates, J. 556-568, 2016.ĭharmendra, M., Suresh, S., Sujith Kumar, C.S., and Yang, Q., Pool Boiling Heat Transfer Enhancement using Vertically Aligned Carbon Nanotube Coatings on a Copper Substrate, Appl. 1345-1357, 2017b.ĭeng, D., Feng, J., Huang, Q., Tang, Y., and Lian, Y., Pool Boiling Heat Transfer of Porous Structures with Re-Entrant Cavities, Int. 454-465, 2017a.ĭas, S., Saha, B., and Bhaumik, S., Experimental Study of Nucleate Pool Boiling Heat Transfer of Water by Surface Function-alization with Crystalline TiO2 Nanostructure, Appl. 793-804, 2009.ĭas, S., Saha, B., and Bhaumik, S., Experimental Study of Nucleate Pool Boiling Heat Transfer of Water by Surface Function-alization with SiO2 Nanostructure, Exp. and Chouarfa, F., Validity of Solid-Liquid Bubble Interface Modeling in Partial Nucleate Boiling, Heat Transf. 124-130, 2016.Īuracher, H., Marquardt, W., Buchholz, M., Hohl, R., Luttich, T., and Blum, J., New Experimental Results on Steady-State and Transient Pool Boiling Heat Transfer, Therm. The critical heat flux and boiling heat transfer enhancement at low wall superheat reveals a better heat transfer mechanism for an effective thermal management system.Īn, S., Kim, D.Y., Lee, J.G., Jo, H.S., and Yoon, S.S., Supersonically Sprayed Reduced Graphene Oxide Film to Enhance Critical Heat Flux in Pool Boiling, Int. The reason for this enhancement was due to increased nucleation site density which deals with the bubble formation and departure. The results showed that the critical heat flux was enhanced by 45%, 53%, and 62%, whereas the boiling heat transfer coefficient was 63%, 97%, and 130% for 250-nm-, 500-nm-, and 750-nm-thick surfaces, respectively.

The critical heat flux (CHF) and boiling heat transfer coefficient (HTC) were calculated, and compared with bare copper substrate.

The nucleate boiling test was carried out by the pool boiling experimental setup for deionized (DI) water at saturation temperature and atmospheric pressure.

The wettability of surfaces was improved significantly because of active nucleation sites created by thin-film coating. The contact angle of the SiO 2 and copper-coated hybrid surface was measured by goniometer, and structural studies were conducted by images from a scanning electron microscope and a stylus profilometer. The thickness of the coating was selected as 250 nm, 500 nm, and 750 nm. In the present experimental investigation, the copper substrates were coated by SiO 2 and copper hybrid thin film by the radio frequency sputtering method. The concept of boiling heat transfer is applied to cool the equipment for better thermal management system.

The present scenario shows that the usages of electronics equipment are very extensive because of its performance and compactness.

Roughness of copper pipe